NEWS

About the Topcon Finetech Business Reorganization

Apr 01, 2012

Thank you for using Topcon products.

As of April 1, Topcon Corporation discontinued its Finetech Business Unit, transferring four promising business categories under the control of Topcon Technohouse Corporation.

We ask for your continued support and patronage.

For more information, please following as below:

  • Discontinued Products :

          - Wafer Bump 3D Inspection System : Vi-Z series

          - Substrate 3D Inspection System : SB-Z series

We will continue to offer support for all Topcon products, including those discontinued products.